Original 10CC KINGBO RMA-218 BGA Reballing Flux Paste No-Clean Repair Soldering Solder Paste With Needle
RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages.
It has less residue, good tinning, bright soldering point and less smoke, you can rest assured to use it.
Widely used for moderate activity of rosin flux paste, the phone card computer graphics card SMD rework.
Hood quality. The flux paste can stick more tighter.
RMA-218 Flux And Needle ONLY,other accessories demo in the picture is not included.
Material: Plastic + Solder Paste
Color: As picture shown
Viscosity: 70 (Pa•S)
Granularity: 9 (um)
No retail package
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
|Model||Original 10CC KINGBO RMA-218|
|Model Number||Original 10CC KINGBO RMA-218|